Revolutionizing Multi-Chiplet Design
Cadence Virtuoso's 3D-IC Design Solutions offer a comprehensive suite of tools and capabilities that span integration, packaging, custom and digital implementation, verification, system analysis, and interconnect IP for chiplet-based designs. This comprehensive solution serves as a one-stop shop for designers looking to embark on multi-chiplet design and advanced IC packaging projects. With a proven design flow, the Cadence 3D-IC solution provides seamless 3D design planning, implementation, and system analysis in a unified cockpit, enabling efficient hardware and software co-verification. This allows for full-system power analysis using emulation and prototyping, ensuring chiplet-based PHY IP connectivity optimized for power, performance, and area (PPA).
Key Benefits of Cadence Virtuoso 3D-IC Solutions
With over 25 years of expertise in advanced packaging, Cadence Virtuoso empowers its customers to achieve higher bandwidth, lower power consumption, and reduced area without relying solely on traditional process scaling. The 3D-IC solution enables heterogeneous integration of different dies for 2.5D or 3D designs, offering system-driven PPA to maximize power efficiency without compromising performance. Additionally, Cadence Virtuoso supports a wide range of applications in AI, data center, graphics, and mobile communications ICs with a smaller form factor, ensuring maximum functionality and versatility.
Comprehensive Offerings for 3D-IC Design
Cadence Virtuoso's 3D-IC Design Solutions address the diverse requirements of 3D-IC design for digital SoCs, analog/mixed-signal designs, and entire systems. The platform includes features such as multi-chiplet planning, design planning, logic die DFT, signoff and analysis, thermal management, multi-die physical verification, validation and power analysis, and chiplet-based IP. The Integrity 3D-IC Platform, based on Cadence's leading digital implementation solution, allows system-level designers to efficiently plan, implement, and analyze stacked die systems for various packaging styles (2.5D or 3D). By facilitating system analysis, including co-design, the platform seamlessly integrates with Cadence's Virtuoso and Allegro analog and package implementation environments, offering an industry-leading solution for multi-chiplet planning and implementation.