Cadence Virtuoso Solutions for Hyperscale Computing
Cadence Virtuoso offers a comprehensive suite of tools and technologies designed to empower the next generation of hyperscale data centers. With years of experience in collaborating with customers, Cadence provides support in designing, verifying, implementing, and optimizing IP, chips, and systems for hyperscale applications. The solution encompasses low-power, 3D-IC, and artificial intelligence/machine learning (AI/ML) technologies, addressing the entire data journey of hyperscale computing. From storage and transmission to data processing requirements for sensors, devices, and near/far-edge processing, Cadence Virtuoso enables workload-optimized computing in local cloud data centers.
Key Benefits of Using Cadence Virtuoso
Cadence Virtuoso offers several key benefits for hyperscale computing design. These include the ability to design advanced-node devices, edge and data center chip design that goes beyond reticle limits. The solution enables a shift-left approach to hardware and software integration, minimizing development schedules and reducing the risk of re-spins. Furthermore, Cadence Virtuoso supports low power and thermal optimization, extending battery life while optimizing energy and thermal effects through integrated development flows. Users can accelerate design time, create 3D-IC derivatives faster, and conduct thorough system design and analysis including thermal, electromagnetic, and fluidic analysis for multi-fabric chips, packages, and systems.
Optimizing Hyperscale Computing Design with Cadence Virtuoso Offerings
Cadence Virtuoso provides a balanced approach to performance, low power consumption, energy efficiency, and cost optimization in hyperscale computing design. The solution allows users to optimize both hardware and software components, as well as system-level thermal effects and fluidity. By embracing 3D-IC integration beyond Moore's Law, Cadence Virtuoso enables the implementation of intricate designs with shorter turnaround times. The solution's offerings extend to data center, edge computing, and 5G communications, supporting chip and system design that pushes the limits of current capabilities in areas like hardware/software co-development, board development, and system analysis. It also addresses the complexities of design beyond reticle limits and the emerging trend of chiplet assembly for yield-efficient manufacturing.