Revolutionizing 5G Technology
In the era of next-generation 5G/6G systems, connectivity to the internet is about to reach unprecedented levels with features like extreme capacity, vast coverage, high reliability, and ultra-low latency. Cadence Virtuoso's extensive portfolio of advanced design tools and IP offers a solution to the challenges posed by 5G system designs. The demands of utilizing the millimeter wave (mmWave) radio frequency spectrum for handsets and infrastructure necessitate fundamental changes in system architecture. With Cadence Virtuoso, designers can create high-complexity electronic-centric systems like SoCs, RFICs, power amplifiers, transceivers, packages, or RF PCBs that meet the stringent requirements of 5G technology. These requirements include high data rates, a large number of connected devices, reliability, security, low latency, and prolonged battery life.
Key Benefits of Using Cadence Virtuoso
Cadence Virtuoso offers a myriad of benefits for 5G communication development. Designers can conduct a full system analysis with comprehensive coverage of thermal, electromagnetic, and circuit behaviors. This analysis helps in ensuring the design's robustness and reliability while saving crucial design time. The toolset also enables the management of long SoC development schedules, reducing the risk of re-spins. Additionally, the low-power design techniques provided by Cadence Virtuoso contribute to extending battery life. Designers can accelerate the verification process of complex designs with high-speed interfaces and stringent security requirements, ensuring faster time to market for 5G products.
Offerings for 5G System Design
Cadence Virtuoso caters to various aspects of 5G system design, including 5G handsets, 5G radioheads, 5G baseband and edge computing, and 5G fronthaul and backhaul. For instance, the mid-band spectrum ranging from 3.5GHz to 6GHz, suitable for 5G handsets, poses specific challenges related to linearity, power efficiency, and thermal management. Cadence Virtuoso offers highly integrated RF modules to address these challenges effectively. Designers can benefit from features like co-design of RFIC/MMIC, BAW/SAW filters, packages, and modules with system-level thermal and electromagnetic (EM) in-design analysis, IP, fast simulation, chip verification, and compact DSPs.