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Products-KLA YieldStar

Empowering Tomorrow's Innovations: KLA YieldStar Solutions and Support

Driving Technological Advancements

KLA YieldStar, a part of KLA Advance, stands at the forefront of technological innovation, empowering the development of tomorrow's groundbreaking technologies. With a strong emphasis on collaborating with pioneering technology companies, KLA YieldStar plays a vital role in ensuring that the ideas of today translate into the realities of tomorrow. Whether it's the intricate workings of a driverless car, the immersive experience of virtual reality, or the precision of factory robotics, KLA YieldStar transforms theoretical concepts into tangible possibilities. Its tools and systems are instrumental in the creation of technological devices that shape our current lives and will define the future.

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Enhancing IC Component Inspection and Metrology with KLA YieldStar

Advanced Optical Inspection with ICOS™ T3/T7 Series

KLA’s ICOS™ T3/T7 Series offers advanced options for fully automated optical inspection of packaged integrated circuit (IC) components, whether they come in trays (T3) or tapes (T7) output. These systems are designed to provide heightened sensitivity to small defect types while ensuring accurate and repeatable 3D metrology measurements, crucial for detecting issues that could impact the final package quality. By incorporating Artificial Intelligence (AI) systems with deep learning algorithms, the ICOS T3/T7 Series can smartly categorize different defect types, aiding in efficient and precise component sorting.

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Revolutionizing Solder Mask Imaging with KLA YieldStar Direct Imaging Solutions

Highly Accurate Direct Imaging for Solder Mask Applications

KLA's direct imaging (DI) solutions for solder mask (SM) go beyond traditional imaging techniques to offer high-accuracy, high-quality imaging with impressive production throughput capabilities. These cutting-edge solutions cater to a wide range of solder mask designs, from simple to highly complex configurations. Whether it's high-density interconnects (HDI), multi-layer boards (MLB), flexible printed circuit boards (FPCB), or specialized white solder mask applications like miniLED backlight units, KLA's solutions ensure consistently precise imaging quality at a low total cost of ownership.

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KLA YieldStar: Revolutionizing Semiconductor Software Solutions

Klarity® Automated Defect and Yield Data Analysis

KLA's Klarity® Defect system provides real-time excursion identification, automating defect analysis to accelerate yield learning cycles. Klarity® SSA enhances defect classification, aiding in process issue detection. Klarity® ACE XP enables yield sharing across fabs for faster yield acceleration. These systems support lot dispositioning, defect source analysis, and excursion notifications, reducing inspection, classification, and review data workload.

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Optimizing PCB and IC Substrate Manufacturing with KLA YieldStar Chemistry Process Control

Enhancing Plating and Coating Chemistries

KLA's chemistry process control products, including the KLA YieldStar, play a vital role in optimizing various processes within the printed circuit board (PCB) and IC substrate manufacturing environments. These products facilitate the analysis and monitoring of plating and coating chemistries, ensuring the highest quality outcomes. Through the utilization of a patented cyclic voltametric stripping (CVS) technique, the KLA YieldStar effectively analyzes PCB plating baths, providing crucial insights to support optimal plating processes.

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Maximizing Chip Manufacturing Efficiency with KLA YieldStar Metrology Solutions

Archer™ Overlay Metrology Systems

KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.

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Empowering IoT Device Production with KLA YieldStar

Meeting the Demand for IoT Devices

In today's technological landscape, the Internet of Things (IoT) has propelled semiconductors to the forefront of every industry. The demand for low-cost devices with high-volume production capabilities and a variety of chip types, including those designed for 200mm and large design-rule nodes, has skyrocketed. To cater to this demand, fabs are upgrading and utilizing certified and remanufactured tools, originally introduced for cutting-edge design nodes. This surge in demand is fueled by the necessity for more mobile, automotive, and industrial IoT devices.

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Revolutionizing Advanced Packaging with KLA YieldStar Wafer Processing Systems

KLA YieldStar Wafer Processing Systems Overview

KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.

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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

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Accelerating Reliability for Automotive Electronics with KLA YieldStar

Continuous Improvement Program for Automotive Fabs

Semiconductors and electronic components play a crucial role in driving innovation within the automotive industry. To ensure the reliability and quality of automotive electronics, KLA YieldStar offers a Continuous Improvement Program (CIP). This program leverages unpatterned wafer defect inspection to pinpoint the specific process tools responsible for defects. By implementing a tool monitoring CIP, automotive fabs can establish concrete targets for reducing process defects that impact reliability. This proactive approach allows manufacturers to enhance the overall quality of automotive electronics and drive continuous improvement.

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