3935 and 3920 EP Systems
KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.
2965 and 2950 EP Systems
The 2965 and 2950 EP broadband plasma defect inspection systems by KLA introduce advancements in optical defect inspection, enabling the discovery of yield-critical defects on logic nodes of ≤5nm and leading-edge memory design nodes. Featuring enhanced broadband plasma illumination technologies such as Super•Pixel™ mode and advanced detection algorithms, these systems are tailored to provide the necessary sensitivity for capturing critical defects across various process layers, material types, and process stacks. The 2965 system, in particular, is optimized for detecting critical nanosheet defects, essential for chip manufacturers working with gate all around transistor architectures, while the 2950 EP incorporates hardware, algorithm, and defect binning innovations that aid in defect discovery and monitoring specifically for 3D NAND and DRAM devices. Additionally, known for being an industry-standard solution for inline monitoring, the 2965 and 2950 EP combine sensitivity with speed in optical wafer defect inspection, ensuring quick defect discovery and thorough defect issue characterization at a cost-effective rate.
C30x Series Systems
KLA's C30x Series broadband plasma optical defect inspectors are engineered to enable systematic defect discovery and latent reliability defect detection for chip manufacturing in various sectors like automotive, IoT, 5G, consumer electronics, and industrial markets such as military, aerospace, and medical. Leveraging a tunable broadband illumination source, advanced optics, and low noise sensors, the C30x inspectors possess the capability to capture critical defects across a wide range of process layers and device types. The inclusion of NanoPoint™ technology allows focused inspection on pattern areas deemed high risk for reliability failures, generating actionable defect data that can decrease die underkill and overkill. By accelerating the characterization and optimization of new processes, design nodes, and devices during research and development, the C30x inspectors play a vital role in expediting the production process. In a manufacturing setting, these systems offer high sensitivity at optical inspection speed, enabling inline monitoring for critical process layers and preventing defect excursions that could impact final chip quality. Furthermore, the C30x inspectors are built on an extendible and configurable platform that supports wafer sizes of 200mm and 300mm.
Voyager® 1035 System
The Voyager® 1035 laser scanning inspection system by KLA is designed to support production ramp defect monitoring for advanced logic and memory chip manufacturing processes. Equipped with the DefectWise® deep learning algorithm, this system excels in separating key Defects Of Interest (DOI) from pattern nuisance defects, enhancing the overall defect capture rate. Utilizing oblique illumination and new sensors with improved quantum efficiency, the Voyager 1035 offers higher throughput and superior sensitivity for lower dose inspection of delicate photoresist layers, as required for applications like after develop inspection (ADI) and photo cell monitoring (PCM) in EUV lithography. By combining high throughput, exceptional sensitivity, and deep learning capabilities, the Voyager 1035 ensures the efficient capture of critical defects in the litho cell and other fab modules, thereby facilitating rapid identification and rectification of process issues.
Puma™ 9980 System
The Puma™ 9980 laser scanning inspection system by KLA incorporates multiple sensitivity and speed enhancements to capture critical Defects Of Interest (DOI) at throughputs necessary for high volume manufacturing of advanced logic devices at 1Xnm, advanced DRAM, and 3D NAND memory devices. As part of an advanced portfolio of wafer defect inspection and review tools, the Puma 9980 stands out as the highest throughput solution for production ramp monitoring, enabling enhanced capture of defect types on advanced patterning layers. With the inclusion of the NanoPoint™ design-aware capability, this system delivers more actionable inspection results through heightened defect sensitivity, improved systematic nuisance binning, and enhanced defect coordinate accuracy. Additionally, the I-PAT® automated, inline die screening solution for Puma 9980 and Puma 9850 offers further insights into the capabilities and applications of these systems.
8 Series Inspection Systems
The 8 Series of patterned wafer inspection systems by KLA are designed to detect a wide array of defect types at incredibly high throughput rates for rapid identification and resolution of production process issues. These systems offer cost-effective defect monitoring for chip manufacturing across various substrates such as silicon, SiC, GaN, and glass, supporting product development from inception through to volume production. The latest generation 8935 inspector leverages cutting-edge optical technologies alongside advanced techniques like DesignWise® and FlexPoint™ precise area inspection to capture critical defects that can potentially lead to chip failures. Further facilitated by DefectWise® AI technology, these systems enable fast and inline separation of defect types, enhancing defect discovery and binning processes. The 8935 system ensures high productivity in capturing yield and reliability-related defects at a minimal nuisance rate, aiding chip manufacturers in accelerating product delivery at reduced costs.