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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

KLA's Contribution to 5G Enablement

KLA's suite of products plays a vital role in every stage of the 5G component manufacturing process, from research and development to high-volume production of ICs, packages, and PCBs. By ensuring the adherence to the highest quality and reliability standards, KLA empowers the seamless integration of 5G technology across various applications and industries. The company's focus on semiconductor IC quality, packaging inspection, semiconductor manufacturing, and specialty processes highlights its commitment to driving the advancement and adoption of 5G technologies.

Innovative Solutions for 5G Devices

As 5G applications continue to proliferate, the demand for electronic devices incorporating RF power amplifiers, high-frequency filters, sensors, and MEMS devices is intensifying. KLA's robust IC process technologies and comprehensive process control strategies elevate chip performance and reliability, crucial for supporting the functionality of these advanced devices. Moreover, the evolution of IC packaging architectures, such as system in package (SiP) and fan-out approaches, necessitate sophisticated process technologies like etch, PVD, CVD, and UV laser drilling. These techniques facilitate the development of intricate packaging schemes that underpin the creation of 5G devices.

Enhancing PCB Manufacturing for 5G

The advent of 5G technology requires highly advanced printed circuit boards (PCBs) featuring precise linewidths, straight sidewall geometry, and multiple layers with stringent quality standards. Through innovative PCB inspection, repair, and imaging systems, KLA assists manufacturers in identifying and rectifying defective layers, enhancing the overall yield and reliability of finished PCBs. These solutions contribute to the seamless integration of 5G technology by supporting the production of high-quality PCBs indispensable for next-generation communication devices.

Enhancing Advanced Wafer-Level Packaging with KLA YieldStar Technology

Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection

The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).

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Advancements in Broadband Plasma Patterned Wafer Defect Inspection Systems by KLA YieldStar

3935 and 3920 EP Systems

KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.

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Elevating Chip Manufacturing with KLA YieldStar

Advanced Solutions for Chip Manufacturing

KLA's YieldStar is a cutting-edge process control and process enabling solution that plays a critical role in supporting chip manufacturing across various device types. From advanced logic and memory technologies such as 3D NAND, DRAM, and MRAM to power devices, RF communications devices, LEDs, photonics, and MEMS, KLA YieldStar offers a comprehensive suite of tools to enhance the fabrication process.

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Optimizing Manufacturing Processes with KLA YieldStar Software Solutions

Challenges in Semiconductor and PCB Manufacturing

Manufacturing facilities in the electronics industry face significant challenges with managing intricate processes across various components like wafers, reticles, chips, packaging, and PCBs. The complexity of these processes leaves very little room for error, emphasizing the need for precise data management and analysis.

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Enhancing Advanced Packaging Manufacturing with KLA YieldStar Chemistry Process Control

Advanced Packaging Manufacturing Solutions

KLA's chemistry process control products, such as the KLA YieldStar, play a pivotal role in supporting various applications within advanced packaging manufacturing. These products are designed to analyze and monitor the usage of wet chemicals in critical processes like wafer-level packaging (WLP), panel-level packaging (PLP), and IC substrates. Whether it's developing new packaging technologies or implementing fully automated online chemical monitoring solutions, KLA's products empower engineers to control and optimize advanced packaging processes with precision.

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