Advanced Packaging Manufacturing Solutions
KLA's chemistry process control products, such as the KLA YieldStar, play a pivotal role in supporting various applications within advanced packaging manufacturing. These products are designed to analyze and monitor the usage of wet chemicals in critical processes like wafer-level packaging (WLP), panel-level packaging (PLP), and IC substrates. Whether it's developing new packaging technologies or implementing fully automated online chemical monitoring solutions, KLA's products empower engineers to control and optimize advanced packaging processes with precision.
Optimizing Processes for Higher Yield and Reliability
The data generated by KLA's chemistry process control systems is instrumental in enabling packaging manufacturers to swiftly optimize their processes. By leveraging the insights provided by these systems, manufacturers can fine-tune their operations to achieve higher levels of yield and reliability in their production. This optimization not only improves the overall quality of the packaging but also contributes to enhanced efficiency and cost-effectiveness in the manufacturing process.
Industry-Leading Chemical Analysis and Monitoring
KLA's YieldStar chemistry process control solution stands out for its industry-leading capabilities in chemical analysis and monitoring. With a focus on applications specific to advanced packaging manufacturing, including technologies like through silicon via (TSV), bumping, re-distribution layer (RDL), copper pillar, and under bump metallization (UBM) processes, the YieldStar system offers comprehensive support for the crucial steps involved in WLP processes. Additionally, it caters to panel and IC substrate packaging technologies, covering processes such as desmear, PTH, electroplating copper, and final finish, thereby ensuring a holistic approach to chemistry process monitoring.
Enabling Rapid Process Optimization
One of the key benefits of KLA's chemistry process control products, exemplified by the YieldStar system, is their ability to facilitate rapid process optimization. By providing real-time data and insights into key parameters of the manufacturing process, these products empower engineers and manufacturers to make quick adjustments and decisions that can significantly improve the efficiency and effectiveness of their operations. This agility in process optimization not only accelerates time-to-market for new products but also enhances overall productivity and competitiveness in the advanced packaging industry.