Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection
The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).
CIRCL™-AP: Comprehensive All-Surface Wafer Defect Inspection and Metrology
The CIRCL™-AP cluster system is a versatile tool provided by KLA YieldStar for all-surface inspection, metrology, and review in advanced wafer-level packaging processes. Designed to offer high-throughput performance, the CIRCL™-AP cluster system is essential for efficient process control of various advanced packaging applications like 2.5D/3D integration, wafer-level chip scale packaging (WLCSP), and fan-out wafer-level packaging (FOWLP). Supporting bonded, thinned, and warped substrates, this system ensures production-proven process control for critical packaging elements like Cu pillars, bumps, through silicon vias (TSVs), and redistribution layers (RDL). By providing high sensitivity and efficiency, the CIRCL™-AP system enables chip manufacturers to streamline their packaging processes and enhance overall quality control.
PWG5™ with XT Option: Precision Patterned Wafer Metrology for Thick Wafers
The PWG5™ with XT Option from KLA YieldStar is a patterned wafer metrology platform that focuses on eXtra Thick wafers, particularly in wafer-to-wafer bonding applications. This system produces dense shape data, comprehensive wafer flatness data, and dual-sided nanotopography information critical for monitoring wafer shape in bonding processes. The XT Option, an add-on feature for the PWG5™, leverages novel enhancements, additional calibration, and passivation technologies to ensure high precision and stability in measuring thick wafers. With advanced handling capabilities and high-resolution measurement techniques, the PWG5™ with XT Option enables manufacturers to achieve superior control and yield improvements in the wafer-to-wafer bonding process, addressing issues such as void detection, bonding chuck hotspot identification, and overall process monitoring.
irArcher®: Advancing Overlay Metrology in Wafer-to-Wafer Bonding
The innovative irArcher® 007 overlay metrology system by KLA YieldStar is a robust solution for characterizing and monitoring overlay performance in advanced wafer-to-wafer alignment bonding processes. By utilizing short wavelength infrared (SWIR) illumination modes, the irArcher® 007 system ensures accurate overlay measurements on pre-grinded bonded wafers with minimal noise interference. The system's focus system delivers fast, reliable overlay measurements for within-wafer and wafer-to-wafer applications, supporting multiple bonders in manufacturing facilities. With features like full factory automation, advanced process control infrastructure, and high-bow wafer handling capabilities, the irArcher® 007 system is tailored for processes involving 3D heterogeneous integration, enabling engineers to monitor and enhance alignment accuracy and final product yield effectively.
Zeta™-5xx/6xx: Automated Metrology Systems for Advanced Packaging
The Zeta™-5xx Series optical profilers offered by KLA YieldStar are advanced, fully automated 300mm wafer metrology systems designed for precise measurement across various applications in advanced wafer-level packaging. These systems can accurately measure bump height, redistribution layer (RDL) critical dimensions, under bump metallization (UBM) step height, film thickness, and wafer bow, crucial parameters for process control in the packaging industry. With multi-mode optics that support a wide variety of measurement types, the Zeta™-5xx Series profilers deliver high-resolution 3D images and detailed analysis, empowering manufacturers with the data needed to drive yield improvement through process feedback cycles. For panel-based wafer-level packaging applications, the Zeta™-6xx Series profilers extend the same level of metrology measurement capability available in the 5xx Series, enabling comprehensive process control and optimization.