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Products-KLA YieldStar

Enhancing IC Component Inspection and Metrology with KLA YieldStar

Advanced Optical Inspection with ICOS™ T3/T7 Series

KLA’s ICOS™ T3/T7 Series offers advanced options for fully automated optical inspection of packaged integrated circuit (IC) components, whether they come in trays (T3) or tapes (T7) output. These systems are designed to provide heightened sensitivity to small defect types while ensuring accurate and repeatable 3D metrology measurements, crucial for detecting issues that could impact the final package quality. By incorporating Artificial Intelligence (AI) systems with deep learning algorithms, the ICOS T3/T7 Series can smartly categorize different defect types, aiding in efficient and precise component sorting.

Comprehensive Inspection Capabilities with ICOS™ T890XP

The ICOS™ T890XP component inspector from KLA sets a high standard for packaged IC and singulated substrate inspection and metrology systems. This tool offers fully automated optical inspection for a wide range of IC components, ensuring accurate and repeatable 3D metrology measurements along with advanced visual inspection (AVI) capabilities that cover all six sides of a component for comprehensive defect detection. By enabling parallel operation of four independent inspection stations and a component sorting station, the ICOS T890XP achieves high throughput and cost-effective component inspection.

KLA YieldStar: Revolutionizing Semiconductor Software Solutions

Klarity® Automated Defect and Yield Data Analysis

KLA's Klarity® Defect system provides real-time excursion identification, automating defect analysis to accelerate yield learning cycles. Klarity® SSA enhances defect classification, aiding in process issue detection. Klarity® ACE XP enables yield sharing across fabs for faster yield acceleration. These systems support lot dispositioning, defect source analysis, and excursion notifications, reducing inspection, classification, and review data workload.

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Optimizing PCB and IC Substrate Manufacturing with KLA YieldStar Chemistry Process Control

Enhancing Plating and Coating Chemistries

KLA's chemistry process control products, including the KLA YieldStar, play a vital role in optimizing various processes within the printed circuit board (PCB) and IC substrate manufacturing environments. These products facilitate the analysis and monitoring of plating and coating chemistries, ensuring the highest quality outcomes. Through the utilization of a patented cyclic voltametric stripping (CVS) technique, the KLA YieldStar effectively analyzes PCB plating baths, providing crucial insights to support optimal plating processes.

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Revolutionizing Solder Mask Imaging with KLA YieldStar Direct Imaging Solutions

Highly Accurate Direct Imaging for Solder Mask Applications

KLA's direct imaging (DI) solutions for solder mask (SM) go beyond traditional imaging techniques to offer high-accuracy, high-quality imaging with impressive production throughput capabilities. These cutting-edge solutions cater to a wide range of solder mask designs, from simple to highly complex configurations. Whether it's high-density interconnects (HDI), multi-layer boards (MLB), flexible printed circuit boards (FPCB), or specialized white solder mask applications like miniLED backlight units, KLA's solutions ensure consistently precise imaging quality at a low total cost of ownership.

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Maximizing Chip Manufacturing Efficiency with KLA YieldStar Metrology Solutions

Archer™ Overlay Metrology Systems

KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.

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Revolutionizing Advanced Packaging with KLA YieldStar Wafer Processing Systems

KLA YieldStar Wafer Processing Systems Overview

KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.

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