Serena™ Direct Imaging System for Advanced IC Substrates
The Serena™ direct imaging system offered by KLA YieldStar represents a cutting-edge lithography solution tailored for advanced IC substrates. With the demand for tight alignment and fine line designs increasing, Serena provides a flexible digital solution that enhances efficiency while maintaining quality. This innovative system utilizes KLA's Large Scan Optics (LSO)™ Technology along with an in-scan focus system to ensure uniform and stitch-less trace patterns across non-flat or distorted organic substrate topographies. Moreover, Serena incorporates advanced registration and scaling mechanisms that optimize overlay accuracy and alignment, facilitating higher I/O density designs for IC manufacturers. By adopting the Serena system, manufacturers can achieve maximum yield and efficiency in patterning large-area, high-layer-count ABF substrates with uneven topographies.
Corus™ Double-Sided Direct Imaging System for Advanced HDI and IC Substrates
The Corus™ 8M double-sided direct imaging system by KLA YieldStar is a fully automated solution designed for advanced high-density interconnect (HDI) processes and IC substrate mass production. This integrated system boasts exceptional capabilities, including the ability to replace an entire direct imaging line. With features like Double-Sided Imaging (DSI)™, Large Scan Optics (LSO)™, and MultiWave Laser™ technologies, the Corus system delivers super-fine, highly uniform lines with outstanding accuracy, unlocking new possibilities for manufacturers and designers alike. By leveraging a compact, closed, and eco-friendly design, the Corus system ensures cutting-edge performance and efficiency, ultimately reducing the total cost of ownership.
Orbotech Infinitum™ Roll-to-Roll Direct Imaging for Flex PCBs
The Orbotech Infinitum™ 10/10XT direct imaging system from KLA YieldStar is specifically engineered for the mass production of flexible PCBs. Powered by KLA's Drum Direct Imaging (DDI)™ technology, the Orbotech Infinitum system excels in material handling and high-speed imaging, offering superior yield and throughput. Equipped with Large Scan Optics (LSO)™ and MultiWave Laser™ technologies, this compact and closed system delivers precise line quality with exceptional accuracy and uniformity, even when working with delicate flex materials. The all-in-one solution ensures optimal performance and efficiency for roll-to-roll direct imaging applications.
Orbotech Nuvogo™ and Nuvogo™ Fine Direct Imaging Solutions
The Orbotech Nuvogo™ series includes both the standard Nuvogo™ and the Nuvogo™ Fine 10 direct imaging systems, which cater to mass production and high-density interconnect (HDI) markets. These systems leverage KLA's Large Scan Optics (LSO)™ technology to deliver superior imaging quality and throughput for fine-line structures on a variety of resist types. The Nuvogo™ Fine 10 system, in particular, offers exceptional resolution patterning with high throughput, utilizing MultiWave Laser™ technology for enhanced uniformity and flexibility. With advanced registration targets support, scalability, and dual-table mechanisms, the Nuvogo™ series ensures high productivity and efficiency in direct imaging processes.