Klarity® Automated Defect and Yield Data Analysis
KLA's Klarity® Defect system provides real-time excursion identification, automating defect analysis to accelerate yield learning cycles. Klarity® SSA enhances defect classification, aiding in process issue detection. Klarity® ACE XP enables yield sharing across fabs for faster yield acceleration. These systems support lot dispositioning, defect source analysis, and excursion notifications, reducing inspection, classification, and review data workload.
OVALiS On‐product Process Optimization, Diagnostics, Monitoring and Control
The OVALiS suite optimizes semiconductor lithography processes by combining metrology data with fab automation context. Through simulation and diagnostics, OVALiS aids in on-product performance improvement, seamlessly integrating with SPC, FDC, and yield management systems for enhanced control.
5D Analyzer® Advanced Data Analysis and Patterning Control
KLA's 5D Analyzer® supports analytics and visualization for process optimization, monitoring, and patterning control in advanced node semiconductor production. Handling data from different fab sources, it enables offline and real-time applications like overlay analysis and reticle-wafer shape correlation for superior patterning control.
aiSIGHT™ Pattern-Centric Defect and Metrology Software Solution
aiSIGHT™ utilizes acquired SEM images and chip design data to provide comprehensive defect and pattern measurement information. By uncovering valuable insights from SEM images, aiSIGHT™ enables detailed defect analysis and efficient yield improvement strategies for chip manufacturers.
Anchor Pattern Centric Yield Manager
The Anchor Pattern Centric Yield Manager automates design decomposition and pattern scoring, enabling efficient risk assessment and defect sampling strategies. By leveraging the Design Decomposition Database™ and SEM image data, it offers pattern risk feedback to lithography teams for improved process control.
SPOT® Automated Predictive Analytics for Fab Process and Yield Management
SPOT® is a production machine learning platform for chip fabs, enhancing defect capture rate through advanced machine learning models. By analyzing inspection data, SPOT® optimizes review sample plans, leading to increased detection of critical defects and improved process and yield management.
I-PAT® Inline Die-Level Screening
KLA's I-PAT® method allows automobile manufacturers to identify and exclude die with latent reliability defects. By screening die inline, I-PAT® helps reduce the incidence of premature die failures, improving the quality of semiconductor electronic components supplied to the automotive industry.