Archer™ Overlay Metrology Systems
KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.
ATL™ Overlay Metrology Systems
The ATL100™ scatterometry-based overlay metrology system by KLA provides overlay control for development and high-volume manufacturing at ≤7nm design nodes. Featuring tunable laser technology with 1nm resolution and real-time Homing™, the ATL100 maintains high overlay accuracy despite production process variations. It supports a wide range of scatterometry overlay measurement target designs, ensuring accurate overlay error measurement for various process layers, device types, design nodes, and patterning technologies.
Axion® X-ray Critical Dimension (CD) and Shape Metrology System
KLA's Axion® T2000 X-ray Metrology System offers high-resolution, fast, accurate, and non-destructive 3D shape measurements for advanced 3D NAND and DRAM chips. This system identifies subtle structural variations that can impact memory device performance and yield, providing inline, non-destructive measurements for rapid learning cycles during R&D and high-volume manufacturing. The Axion T2000 ensures quick issue identification and resolution, maintaining stable production.
SpectraShape™ Optical Critical Dimension (CD) and Shape Metrology Systems
The SpectraShape™ 11k metrology system is designed to fully characterize and monitor the critical dimensions and shapes of complex features on integrated circuits at leading-edge design nodes. Using advanced optical technologies and patented algorithms, this system identifies subtle variations in critical device parameters, supporting fast process issue identification inline. With improved throughput, SpectraShape 11k aids fabs in accelerating yield ramps and achieving stable production.
SpectraFilm™ Film Metrology Systems
KLA's SpectraFilm™ F1 system provides high-precision thin film measurements for sub-7nm logic and leading-edge memory design nodes. With spectroscopic ellipsometry technology and new FoG™ algorithms, this system offers accurate measurements of film thickness and insight into electrical performance early in the production process. Increased throughput ensures high productivity, supporting the growing number of film layers in leading-edge device fabrication.
Aleris® Film Metrology Systems
The Aleris® film metrology systems by KLA offer precise measurement of film thickness, refractive index, stress, and composition for advanced semiconductor technologies. Using Broadband Spectroscopic Ellipsometry (BBSE) technology, these systems provide comprehensive film thickness measurements and metrology solutions, enabling fabs to qualify and monitor a wide range of film layers effectively.
PWG™ Patterned Wafer Geometry (PWG) Metrology Systems
KLA's PWG™ patterned wafer metrology platform delivers comprehensive data on wafer shape, flatness, and nanotopography for advanced 3D NAND, DRAM, and logic manufacturing. With industry-leading dynamic range and high-resolution sampling, this system identifies process-induced wafer shape variations, enabling inline monitoring and control of wafer warp and stress. The PWG™ platform aids in improving on-product overlay and overall device yield by addressing issues at their source.
Therma-Probe® Implant Metrology Systems
KLA's Therma-Probe® ion implant/anneal metrology systems provide inline implant dose monitoring for various semiconductor technologies. These systems support advanced design node devices and compound semiconductor devices, ensuring accurate and efficient monitoring of implant doses during the manufacturing process. By enabling precise control and monitoring, the Therma-Probe® systems contribute to maximizing chip manufacturing efficiency and overall device performance.