KLA YieldStar Wafer Processing Systems Overview
KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.
SPTS Osprey® PECVD for Advanced Packaging
SPTS offers the Osprey® PECVD system designed specifically for advanced packaging applications. This system excels in low-temperature deposition processes that are compatible with 300mm bonded substrates and molds. The Osprey® PECVD system facilitates the production of high-quality dielectric films at remarkably low deposition temperatures, starting from 110°C. With the capability to deposit SiN-SiO stacks in the same chamber, this system ensures high reliability in electrical performance with excellent stability over time. Additionally, the system allows for fine-tuning of film and stack stress over a wide range, offering optimized chamber hardware to achieve the lowest within-wafer stress range in comparison to other PECVD systems. Single-wafer and multi-wafer degas options are available, along with the deposition of advanced dielectric films like SiO, TEOS SiO, and SiCN for hybrid bonding and inter-die gap-fill applications.
SPTS Omega® Plasma Etch for Silicon Processing
The SPTS Omega® plasma etch systems, particularly the Rapier™ range of process modules, are tailored for high-rate silicon etching in advanced packaging applications. These modules are instrumental in creating vertical or tapered, high aspect ratio via holes or slots through silicon wafers or interposers used in 2.5D/3D-IC packaging. Furthermore, Rapier™ etch modules are ideal for blanket via reveal etching to expose Cu-filled vias from the backside of the wafer. The Rapier™ XE process module offers superior recipe tuneable uniformity and boasts an etch rate that is significantly faster than competing systems. This process can also be utilized for extreme wafer thinning down to 5µm or even 0.5µm by incorporating an etch stop layer. KLA provides patent-protected end-point solutions for TSV etching, via reveal, and extreme thinning processes to ensure optimal throughput and yields in high-volume production.
SPTS Mosaic™ Plasma Dicing for Die Singulation
SPTS Mosaic™ plasma dicing systems introduce an innovative alternative to mechanical saw or laser technologies for singulating die from silicon wafers, especially those up to 300mm in size mounted on frames. This dry chemical process minimizes damage and enhances die strength, while preventing particulate contamination. Notably, plasma dicing is highly beneficial for thin wafers or those containing fragile low k films, as well as for die to wafer bonding applications. The parallel processing nature of plasma dicing ensures substantial throughput, yield, and cost advantages, particularly for dicing small die and thin wafers. Narrower dicing lanes allow for more die per wafer, with the flexibility to accommodate varied die shapes for optimized wafer layouts.
SPTS Sigma® PVD for Metal Deposition in Advanced Packaging
SPTS Sigma® PVD systems specialize in depositing metals like Au, Al, Ti, TiW, and Cu onto Si or mold wafers, addressing the technical challenges posed by advanced packaging technologies incorporating organic passivation and new substrate materials. By incorporating novel degas and pre-clean technology, the Sigma® PVD systems consistently achieve low Rc values while offering a 2 times throughput advantage compared to other PVD systems. In 2.5D and 3D-IC applications, KLA's Advanced Hi-Fill® Ionized PVD source delivers exceptional Cu barrier/seed coverage in high aspect ratio TSVs, ensuring top-notch performance for metal deposition in advanced packaging processes.