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Revolutionizing PCB and IC Substrate Manufacturing with KLA YieldStar Automated Optical Shaping

Introduction to KLA's Automated Optical Shaping (AOS) Systems

KLA's automated optical shaping (AOS) systems are designed to revolutionize the shaping process in PCB and IC substrate manufacturing. These cutting-edge systems offer manufacturers the ability to achieve high-speed, high-quality shaping of both opens and shorts along the production line. By providing an alternative to manual repair methods that often result in damage to adjacent conductors and laminate, KLA's AOS solutions ensure minimum damage to the surrounding area, leading to superior quality shaping for a variety of applications.

Enhancing Efficiency and Yield with Orbotech Precise™ 800X

The Orbotech Precise™ 800X automated optical shaping (AOS) system stands out as a one-stop solution for dealing with excess copper (shorts) and completing patterns accurately where copper is missing (opens). Leveraging advanced technologies such as 3D Shaping (3DS)™ and Closed Loop Shaping (CLS)™, this system enables high-quality 3D shaping for the most sophisticated PCB designs, including any-layer, HDI, and complex multi-layer boards. PCB manufacturers can significantly reduce scrap and enhance operational efficiencies with the Orbotech Precise 800X system, marking a significant advancement in the industry.

Achieving High Yield and Quality with Orbotech Ultra PerFix™

The Orbotech Ultra PerFix™ series of automated optical shaping (AOS) systems is dedicated to delivering top-notch shaping of short defects in advanced IC substrate boards. Through the utilization of Closed Loop Shaping (CLS)™ technology, these systems can accurately shape complex or fine defects on panels that might otherwise be scrapped. IC substrate manufacturers benefit from increased yield and reduced scrap rates, ensuring the production of high-quality boards at scale. Moreover, the systems offer an easy-to-operate, fully automated process with high throughput and a low total cost of ownership (TCO).

Moving Towards Zero-Scrap Production with Orbotech PerFix™ 200S/200S XL

The Orbotech PerFix™ 200S/200S XL automated optical shaping (AOS) system sets a new benchmark for precision in shaping shorts and excess copper defects, achieving high precision down to 30μm line and space. Leveraging Closed Loop Shaping (CLS)™ technology, this system excels in shaping the most advanced PCB designs, including any-layer, HDI, and complex multi-layer boards. With its robust performance, optimized accuracy, and speed, the Orbotech PerFix 200S/200S XL system is driving the PCB industry closer to the goal of zero-scrap production, setting a new standard in quality and efficiency.

Revolutionizing IC Substrate Connectivity with KLA YieldStar

Advancing Connectivity in the Semiconductor Industry

In the rapidly evolving landscape of advanced packaging in the semiconductor industry, interconnected components play a crucial role in delivering performance, power efficiency, and cost-effectiveness. KLA, a prominent leader in semiconductor manufacturing solutions, is spearheading a transformation in IC substrate technology with their innovative YieldStar product portfolio.

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Revolutionizing Semiconductor Manufacturing with KLA YieldStar Deposition Solutions

Introduction to Deposition in Semiconductor Industry

Deposition plays a crucial role in the semiconductor industry by forming thin layers of materials on the wafer surface. These layers can be composed of various materials such as metals or dielectrics, shaping the electronic microstructure and altering surface characteristics of the devices on the wafer. KLA's YieldStar Deposition solutions offer advanced techniques to achieve precise and uniform thin-film deposition.

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Revolutionizing Solar Manufacturing with KLA YieldStar

Introduction to Solar Manufacturing

Solar electricity generation is at the forefront of the global shift towards sustainable energy sources. Photovoltaic (PV) devices are the cornerstone of this solar revolution, making high-quality, high-volume PV manufacturing crucial for success. To achieve this, implementing process control systems and strategies across the solar fab line is essential for enhancing efficiency, yield, and overall profitability.

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Unlocking Chip Manufacturing Excellence with KLA YieldStar

Introduction to KLA YieldStar

KLA YieldStar is a cutting-edge product that revolutionizes yield management in chip manufacturing. With its advanced technology and precision, KLA YieldStar ensures high yields and exceptional quality in semiconductor production. By leveraging broadband plasma (BBP) patterned wafer inspectors, KLA YieldStar pushes the boundaries of optical inspection, enabling manufacturers to detect critical defects early in the manufacturing process.

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Revolutionize Chip Manufacturing with KLA YieldStar In Situ Process Management

Overview of KLA YieldStar In Situ Process Management

KLA's revolutionary product, the YieldStar In Situ Process Management, is a game-changer in the realm of chip manufacturing. This cutting-edge solution offers semiconductor process equipment manufacturers, chip manufacturers, and reticle manufacturers a comprehensive portfolio of SensArray® products. These products enable the in situ monitoring of process tools' environments and wafer handling conditions, providing vital information to visualize, diagnose, and control process and wafer handling conditions.

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