Highly Accurate Direct Imaging for Solder Mask Applications
KLA's direct imaging (DI) solutions for solder mask (SM) go beyond traditional imaging techniques to offer high-accuracy, high-quality imaging with impressive production throughput capabilities. These cutting-edge solutions cater to a wide range of solder mask designs, from simple to highly complex configurations. Whether it's high-density interconnects (HDI), multi-layer boards (MLB), flexible printed circuit boards (FPCB), or specialized white solder mask applications like miniLED backlight units, KLA's solutions ensure consistently precise imaging quality at a low total cost of ownership.
Orbotech Diamond™ 10: Advancing Solder Mask Imaging
The Orbotech Diamond™ 10 DI system is a game-changer in the realm of solder mask imaging. Utilizing KLA's proprietary SolderFast™ technology, this advanced system is tailored for a diverse array of solder mask applications, setting new standards in quality and throughput. From high-density interconnect (HDI) boards to flexible printed circuit boards (FPCB), the Orbotech Diamond 10 system excels in delivering high-quality images for the most intricate designs. By enhancing imaging accuracy and reducing the total cost of ownership, Orbotech Diamond™ 10 elevates the solder mask imaging experience for mass production.
Orbotech Diamond™ 10W: Specialized Direct Imaging for White Solder Mask Applications
When it comes to white solder mask applications, particularly for products like miniLED backlight units, the Orbotech Diamond™ 10W DI system shines. Tailored specifically for white solder mask PCBs, this high-capacity imaging solution leverages KLA's SolderFast™ technology to provide exceptional imaging quality and throughput for mass production. By setting a higher standard for white solder mask applications, the Orbotech Diamond 10W system ensures superior imaging accuracy and quality while minimizing the total cost of ownership, making it the ideal choice for demanding production environments.